The hetero-print project is designed to deliver micro- and nano-transfer printing (μ-TP) system in an effort to produce a high-precision mechanical pick-and-place assembly technique utilising the adhesive properties of soft stamps. These new ‘active stamps’ will versatile and enable scalable manufacture of heterogeneous materials, structures and devices. Within the project we principle focus on producing micro-LEDs, whilst also increasing the capabilities within the manufacture of electronic, photonic, microfluidic, microelectromechanical (MEMS) and other systems. The role of Cambridge Centre for Gallium Nitride in this consortium including the Universities of Manchester, Cardiff, Glasgow and Strathclyde, is to manufacture and providing GaN-on-Si structures that have minimised wafer bow and chiplet bow when released from the support. Using finite element modelling we also simulate the best structures and architectures to minimise adverse effects within the transfer printing.
Image of a GaN chiplet